LPC2138FBD64/01EL vs LPC2138FBD64/01 feature comparison

LPC2138FBD64/01EL NXP Semiconductors

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LPC2138FBD64/01 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description LQFP-64 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 2 Days
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width 8
Bit Size 32 32
Clock Frequency-Max 50 MHz 60 MHz
DAC Channels YES YES
DMA Channels NO NO
External Data Bus Width 8
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 1 1
Number of I/O Lines 47 47
Number of Terminals 64 64
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
RAM (bytes) 32768 32768
ROM (words) 524288 524288
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 60 MHz 60 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3.3 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 4
Pbfree Code Yes
Part Package Code QFP
Pin Count 64
CPU Family ARM7
Package Equivalence Code QFP64,.47SQ,20
Qualification Status Not Qualified

Compare LPC2138FBD64/01EL with alternatives

Compare LPC2138FBD64/01 with alternatives