LPC2138FBD64/01
vs
935281776151
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64
LFQFP,
Pin Count
64
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
2 Days
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Address Bus Width
8
8
Bit Size
32
32
CPU Family
ARM7
Clock Frequency-Max
60 MHz
60 MHz
DAC Channels
YES
YES
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
10 mm
10 mm
Moisture Sensitivity Level
1
1
Number of I/O Lines
47
47
Number of Terminals
64
64
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
32768
ROM (words)
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
60 MHz
60 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
4
1
Compare LPC2138FBD64/01 with alternatives
Compare 935281776151 with alternatives