LPC2131FBD64
vs
LPC2131FBD64/01
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFP
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64
10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64
Pin Count
64
64
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
8
8
Bit Size
32
32
CPU Family
ARM7
ARM7
Clock Frequency-Max
60 MHz
60 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
10 mm
10 mm
Moisture Sensitivity Level
1
1
Number of I/O Lines
47
47
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
8192
8192
ROM (words)
32768
32768
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
60 MHz
60 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3.3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
8
4
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare LPC2131FBD64 with alternatives
Compare LPC2131FBD64/01 with alternatives