LPC1788FET208
vs
935291861551
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
TFBGA, BGA208,17X17,32
LFQFP,
Pin Count
208
Manufacturer Package Code
SOT-950-1
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
26
26
Bit Size
32
32
Clock Frequency-Max
25 MHz
25 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B208
S-PQFP-G208
JESD-609 Code
e1
e3
Length
15 mm
28 mm
Moisture Sensitivity Level
2
2
Number of I/O Lines
165
165
Number of Terminals
208
208
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFQFP
Package Equivalence Code
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
RAM (bytes)
98304
ROM (words)
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
1.6 mm
Speed
120 MHz
120 MHz
Supply Current-Max
100 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
2.4 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
15 mm
28 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Compare LPC1788FET208 with alternatives
Compare 935291861551 with alternatives