LPC1788FBD208
vs
LPC1778FET208
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFP
BGA
Package Description
LFQFP, QFP208,1.2SQ,20
15 X 15 MM, 0.70 MM HEIGHT, PLASTIC, SOT950-1, TFBGA-208
Pin Count
208
208
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Address Bus Width
26
26
Bit Size
32
32
Clock Frequency-Max
25 MHz
25 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
32
32
JESD-30 Code
S-PQFP-G208
S-PBGA-B208
JESD-609 Code
e3
e1
Length
28 mm
15 mm
Moisture Sensitivity Level
2
2
Number of I/O Lines
165
165
Number of Terminals
208
208
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
TFBGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
98304
98304
ROM (words)
524288
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.2 mm
Speed
120 MHz
120 MHz
Supply Current-Max
100 mA
100 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3.3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
28 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Manufacturer Package Code
SOT-950-1
Compare LPC1788FBD208 with alternatives
Compare LPC1778FET208 with alternatives