LPC1788FBD208/CP3E
vs
LPC1788FET208
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
LFQFP,
TFBGA, BGA208,17X17,32
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
26
26
Bit Size
32
32
Clock Frequency-Max
25 MHz
25 MHz
DMA Channels
YES
YES
External Data Bus Width
32
32
Length
28 mm
15 mm
Number of I/O Lines
165
165
Number of Terminals
208
208
PWM Channels
YES
YES
Package Code
LFQFP
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Speed
120 MHz
120 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.4 V
3.3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
208
Manufacturer Package Code
SOT-950-1
ECCN Code
3A991.A.2
DAC Channels
YES
JESD-30 Code
S-PBGA-B208
JESD-609 Code
e1
Moisture Sensitivity Level
2
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA208,17X17,32
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
98304
ROM (words)
524288
ROM Programmability
FLASH
Seated Height-Max
1.2 mm
Supply Current-Max
100 mA
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare LPC1788FBD208/CP3E with alternatives
Compare LPC1788FET208 with alternatives