LPC1765FBD100/3271 vs 935287918557 feature comparison

LPC1765FBD100/3271 NXP Semiconductors

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935287918557 NXP Semiconductors

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description , ,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Base Number Matches 1 1
ECCN Code 3A991.A.2
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan YES
CPU Family CORTEX-M3
Clock Frequency-Max 25 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQFP-G100
JESD-609 Code e3
Length 14 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of DMA Channels 8
Number of External Interrupts 4
Number of I/O Lines 70
Number of Serial I/Os 6
Number of Terminals 100
Number of Timers 6
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
RAM (bytes) 65536
ROM (words) 262144
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 100 MHz
Supply Current-Max 100 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Compare LPC1765FBD100/3271 with alternatives

Compare 935287918557 with alternatives