LP8900TLX-AAAH
vs
LP8900TLE-AAAH/NOPB
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA,
|
1.50 X 1.10 MM, GREEN, MICRO, SMD-6
|
Pin Count |
6
|
6
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Dropout Voltage1-Nom |
0.5 V
|
0.11 V
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
3.2 V
|
3.2 V
|
JESD-30 Code |
R-PBGA-B6
|
R-PBGA-B6
|
Length |
1.463 mm
|
1.463 mm
|
Load Regulation-Max |
0.009%
|
0.009%
|
Number of Functions |
1
|
1
|
Number of Outputs |
2
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.2 A
|
0.2 A
|
Output Current2-Max |
0.2 A
|
0.2 A
|
Output Voltage1-Max |
2.76 V
|
2.76 V
|
Output Voltage1-Min |
2.639 V
|
2.639 V
|
Output Voltage1-Nom |
2.7 V
|
2.7 V
|
Output Voltage2-Max |
2.76 V
|
2.76 V
|
Output Voltage2-Min |
2.639 V
|
2.639 V
|
Output Voltage2-Nom |
2.7 V
|
2.7 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA6,2X3,20
|
BGA6,2X3,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
0.675 mm
|
0.675 mm
|
Surface Mount |
YES
|
YES
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Voltage Tolerance-Max |
2.3%
|
2.25%
|
Width |
1.057 mm
|
1.057 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
Texas Instruments
|
Adjustability |
|
FIXED
|
Input Voltage Absolute-Max |
|
6.5 V
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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