LP87C58-33
vs
SAB8052B-16-P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
SIEMENS A G
Part Package Code
DIP
Package Description
DIP,
,
Pin Count
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
BOOLEAN PROCESSOR
POWER-DOWN PIN VPD 4.5 - 5.5V; BOOLEAN PROCESSOR
Address Bus Width
16
16
Bit Size
8
8
Clock Frequency-Max
33 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
Length
52.26 mm
Number of I/O Lines
32
32
Number of Terminals
40
40
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
OTPROM
MROM
Seated Height-Max
5.08 mm
Speed
33 MHz
16 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Boundary Scan
NO
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
RAM (words)
256
ROM (words)
8192
Supply Current-Max
175 mA
Compare LP87C58-33 with alternatives
Compare SAB8052B-16-P with alternatives