LP3996SD-2828/NOPB
vs
LP3986BL-2929
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SON
Package Description
3 X 3 MM, GREEN, LLP-10
VFBGA, BGA8,3X3,20
Pin Count
10
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustability
FIXED
FIXED
Dropout Voltage1-Max
0.22 V
0.1 V
Dropout Voltage1-Nom
0.11 V
0.06 V
Dropout Voltage2-Max
0.55 V
0.1 V
Input Voltage Absolute-Max
6.5 V
6.5 V
Input Voltage-Max
6 V
6 V
Input Voltage-Min
2 V
2.7 V
JESD-30 Code
S-XDSO-N10
S-PBGA-B8
JESD-609 Code
e3
e0
Length
3 mm
1.55 mm
Line Regulation-Max
0.0185%
0.0096%
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Outputs
2
2
Number of Terminals
10
8
Operating Temperature TJ-Max
125 °C
125 °C
Operating Temperature TJ-Min
-40 °C
-40 °C
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Current1-Max
0.15 A
0.15 A
Output Current2-Max
0.3 A
0.15 A
Output Voltage1-Max
2.905 V
2.987 V
Output Voltage1-Min
2.695 V
2.813 V
Output Voltage1-Nom
2.8 V
2.9 V
Output Voltage2-Max
2.905 V
2.987 V
Output Voltage2-Min
2.695 V
2.813 V
Output Voltage2-Nom
2.8 V
2.9 V
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVSON
VFBGA
Package Equivalence Code
SOLCC10,.11,20
BGA8,3X3,20
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Regulator Type
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
Seated Height-Max
0.8 mm
0.995 mm
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tolerance-Max
3.75%
3%
Width
3 mm
1.55 mm
Base Number Matches
2
3
Samacsys Manufacturer
Texas Instruments
Packing Method
TR
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