LP3996SD-1833
vs
LP3996SD-1833/NOPB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SON
|
|
| Package Description |
HVSON,
|
3 X 3 MM, LEAD FREE, LLP-10
|
| Pin Count |
10
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Dropout Voltage1-Max |
0.22 V
|
0.22 V
|
| Dropout Voltage1-Nom |
0.11 V
|
0.21 V
|
| Dropout Voltage2-Max |
0.55 V
|
0.55 V
|
| Input Voltage-Max |
6 V
|
6 V
|
| Input Voltage-Min |
2 V
|
2 V
|
| JESD-30 Code |
S-XDSO-N10
|
S-XDSO-N10
|
| Length |
3 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
2
|
2
|
| Number of Terminals |
10
|
10
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.15 A
|
0.15 A
|
| Output Current2-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
1.867 V
|
1.867 V
|
| Output Voltage1-Min |
1.732 V
|
1.732 V
|
| Output Voltage1-Nom |
1.8 V
|
1.8 V
|
| Output Voltage2-Max |
3.423 V
|
3.423 V
|
| Output Voltage2-Min |
3.176 V
|
3.176 V
|
| Output Voltage2-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Tolerance-Max |
3.8%
|
3.75%
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Adjustability |
|
FIXED
|
| Input Voltage Absolute-Max |
|
6.5 V
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOLCC10,.11,20
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LP3996SD-1833 with alternatives
Compare LP3996SD-1833/NOPB with alternatives