LP3985IBL-285
vs
IMP2185-3.0JUK/T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
DAILY SILVER IMP MICROELECTRONICS CO LTD
|
| Package Description |
0.995 MM HEIGHT, MICRO, SMD-5
|
,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| Adjustability |
FIXED
|
|
| Dropout Voltage1-Max |
0.1 V
|
|
| Dropout Voltage1-Nom |
0.06 V
|
|
| Input Voltage Absolute-Max |
6.5 V
|
|
| Input Voltage-Max |
6 V
|
|
| Input Voltage-Min |
2.5 V
|
|
| JESD-30 Code |
R-PBGA-B5
|
|
| JESD-609 Code |
e0
|
|
| Length |
1.463 mm
|
|
| Line Regulation-Max |
0.0075%
|
|
| Load Regulation-Max |
0.0085%
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Outputs |
1
|
|
| Number of Terminals |
5
|
|
| Operating Temperature TJ-Max |
125 °C
|
|
| Operating Temperature TJ-Min |
-40 °C
|
|
| Output Current1-Max |
0.15 A
|
|
| Output Voltage1-Max |
2.9355 V
|
|
| Output Voltage1-Min |
2.7645 V
|
|
| Output Voltage1-Nom |
2.85 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFBGA
|
|
| Package Equivalence Code |
BGA5,3X3,17/10
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
|
| Seated Height-Max |
1.095 mm
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Voltage Tolerance-Max |
3%
|
|
| Width |
1.006 mm
|
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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