LP3984ITP-2.9/NOPB
vs
LP3984ITP-2.9
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Package Description
0.500 MM HEIGHT, MICRO, BUMP, SMD-4
VFBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustability
FIXED
Dropout Voltage1-Max
0.12 V
0.12 V
Dropout Voltage1-Nom
0.075 V
Input Voltage Absolute-Max
6.5 V
Input Voltage-Max
6 V
6 V
Input Voltage-Min
2.5 V
2.5 V
JESD-30 Code
R-PBGA-B4
R-PBGA-B4
JESD-609 Code
e1
e0
Length
0.98 mm
0.98 mm
Line Regulation-Max
0.0048%
Load Regulation-Max
0.0087%
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Outputs
1
Number of Terminals
4
4
Operating Temperature TJ-Max
125 °C
125 °C
Operating Temperature TJ-Min
-40 °C
-40 °C
Output Current1-Max
0.15 A
0.15 A
Output Voltage1-Max
2.958 V
2.958 V
Output Voltage1-Min
2.842 V
2.842 V
Output Voltage1-Nom
2.9 V
2.9 V
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA4,2X2,20
BGA4,2X2,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Regulator Type
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
Seated Height-Max
0.575 mm
0.575 mm
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Voltage Tolerance-Max
2%
2%
Width
0.879 mm
0.879 mm
Base Number Matches
1
2
Pbfree Code
Part Package Code
BGA
Pin Count
4
Compare LP3984ITP-2.9/NOPB with alternatives
Compare LP3984ITP-2.9 with alternatives