LP38841MR-ADJ/NOPB
vs
LP38841MR-ADJ
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
ROHS COMPLIANT, PLASTIC, SOP-8
|
PLASTIC, SOP-8
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
Dropout Voltage1-Max |
0.205 V
|
0.205 V
|
Dropout Voltage1-Nom |
0.075 V
|
0.075 V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.93 mm
|
4.93 mm
|
Load Regulation-Max(%) |
1%
|
1%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.8 A
|
0.8 A
|
Output Voltage1-Max |
1.5 V
|
1.5 V
|
Output Voltage1-Min |
0.56 V
|
0.56 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLSOP
|
HLSOP
|
Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
Packing Method |
RAIL
|
RAIL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
1.68 mm
|
1.68 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3.94 mm
|
3.94 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare LP38841MR-ADJ/NOPB with alternatives
Compare LP38841MR-ADJ with alternatives