LMX9838SBX/NOPB
vs
LMX9838SBX
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Package Description |
LGA,
|
LGA, LGA70(UNSPEC)
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PBGA-N70
|
R-PBGA-N70
|
JESD-609 Code |
e4
|
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
70
|
70
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LGA
|
LGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.1 mm
|
2.1 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Gold (Ni/Au)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
LGA
|
Pin Count |
|
70
|
Package Equivalence Code |
|
LGA70(UNSPEC)
|
Supply Current-Max |
|
0.065 mA
|
Technology |
|
CMOS
|
|
|
|