LMX4168FLQX
vs
U3600BM-NFN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEMIC SEMICONDUCTORS
|
| Package Description |
HVQCCN,
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-XQCC-N44
|
|
| Length |
7 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
44
|
|
| Operating Temperature-Max |
60 °C
|
|
| Operating Temperature-Min |
-10 °C
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
HVQCCN
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
7 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LMX4168FLQX with alternatives