LMX4168FLQ
vs
U3600BM-NFNG3
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ATMEL CORP
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
HVQCCN,
|
SSOP, SOP44,.4,32
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N44
|
R-PDSO-G44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
7 mm
|
17.925 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
60 °C
|
75 °C
|
| Operating Temperature-Min |
-10 °C
|
-25 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Nom |
2.5 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
7 mm
|
7.4 mm
|
| Base Number Matches |
3
|
2
|
| Package Equivalence Code |
|
SOP44,.4,32
|
| Supply Current-Max |
|
29 mA
|
|
|
|
Compare LMX4168FLQ with alternatives
Compare U3600BM-NFNG3 with alternatives