LMV932MA
vs
LM2904N/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
SOIC-8
PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.05 µA
0.05 µA
Bias Current-Max (IIB) @25C
0.035 µA
0.25 µA
Common-mode Reject Ratio-Nom
80 dB
70 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5500 µV
10000 µV
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e0
e3
Length
4.9 mm
9.817 mm
Low-Bias
NO
Low-Offset
NO
NO
Micropower
YES
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
RAIL
RAIL
Peak Reflow Temperature (Cel)
235
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.753 mm
5.08 mm
Slew Rate-Nom
0.4 V/us
0.1 V/us
Supply Current-Max
0.46 mA
2 mA
Supply Voltage Limit-Max
5.5 V
26 V
Supply Voltage-Nom (Vsup)
2.7 V
5 V
Surface Mount
YES
NO
Technology
BICMOS
BIPOLAR
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Matte Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Unity Gain BW-Nom
1400
1000
Voltage Gain-Min
3980
25000
Wideband
NO
Width
3.9 mm
7.62 mm
Base Number Matches
4
1
Common-mode Reject Ratio-Min
50 dB
Compare LMV932MA with alternatives
Compare LM2904N/NOPB with alternatives