LMV7231SQE/NOPB
vs
LMV7231SQX
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
QFN
|
QLCC
|
Package Description |
WQFN-24
|
HVQCCN,
|
Pin Count |
24
|
24
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.015 µA
|
0.015 µA
|
Bias Current-Max (IIB) @25C |
0.005 µA
|
|
Input Offset Voltage-Max |
6000 µV
|
|
JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
JESD-609 Code |
e3
|
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
6
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC24,.16SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
5600 ns
|
500 ns
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max |
0.06 mA
|
|
Supply Voltage Limit-Max |
6 V
|
6 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare LMV7231SQE/NOPB with alternatives
Compare LMV7231SQX with alternatives