LMV339MDC vs LMV339IDRE4 feature comparison

LMV339MDC National Semiconductor Corporation

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LMV339IDRE4 Rochester Electronics LLC

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code WAFER
Package Description DIE, DIE OR CHIP SOP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.25 µA 0.4 µA
Bias Current-Max (IIB) @25C 0.25 µA
Input Offset Voltage-Max 7000 µV 9000 µV
JESD-30 Code X-XUUC-N R-PDSO-G14
Number of Functions 4 4
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Type OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified
Response Time-Nom 600 ns 600 ns
Supply Current-Max 0.35 mA
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 2 2
Length 8.65 mm
Number of Terminals 14
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

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