LMV331M5X/NOPB
vs
LMV331MDC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOT-23
|
WAFER
|
| Package Description |
LEAD FREE, SOT-23, 5 PIN
|
DIE, DIE OR CHIP
|
| Pin Count |
5
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.25 µA
|
0.25 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
0.25 µA
|
| Input Offset Voltage-Max |
7000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
X-XUUC-N
|
| JESD-609 Code |
e3
|
|
| Length |
2.92 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LSSOP
|
DIE
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
450 ns
|
600 ns
|
| Seated Height-Max |
1.22 mm
|
|
| Supply Current-Max |
0.15 mA
|
0.15 mA
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
1.6 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LMV331M5X/NOPB with alternatives
Compare LMV331MDC with alternatives