LMV324IYPT
vs
MCP624T-E/ST
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Factory Lead Time |
20 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
Microchip
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.095 µA
|
0.005 µA
|
| Bias Current-Max (IIB) @25C |
0.063 µA
|
|
| Common-mode Reject Ratio-Min |
65 dB
|
68 dB
|
| Common-mode Reject Ratio-Nom |
95 dB
|
84 dB
|
| Frequency Compensation |
NO
|
YES
|
| Input Offset Current-Max (IIO) |
0.025 µA
|
|
| Input Offset Voltage-Max |
6000 µV
|
200 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
5 mm
|
5 mm
|
| Low-Bias |
NO
|
YES
|
| Low-Offset |
NO
|
YES
|
| Micropower |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.25
|
TSSOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
TS 16949
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Slew Rate-Nom |
0.45 V/us
|
10 V/us
|
| Supply Current-Max |
1 mA
|
14.4 mA
|
| Supply Voltage Limit-Max |
7 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Unity Gain BW-Nom |
1300
|
20000
|
| Voltage Gain-Min |
7079.4578
|
25110
|
| Wideband |
NO
|
NO
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
TSSOP, TSSOP14,.25
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare LMV324IYPT with alternatives
Compare MCP624T-E/ST with alternatives