LMV1032UPX-25
vs
LMV1032UR-25/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
VFBGA, BGA4,2X2,20
|
DSBGA-4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
21 kHz
|
21 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
25.5 dB
|
6.2 dB
|
| Harmonic Distortion |
0.35%
|
0.35%
|
| JESD-30 Code |
S-PBGA-B4
|
S-PBGA-B4
|
| JESD-609 Code |
e0
|
e1
|
| Length |
1.133 mm
|
1.1535 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA4,2X2,20
|
BGA4,2X2,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.395 mm
|
0.395 mm
|
| Supply Voltage-Max (Vsup) |
5 V
|
5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
1.133 mm
|
1.1535 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
0.1 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LMV1032UR-25/NOPB with alternatives