LMU217JC25
vs
IDT7217L25C
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
LOGIC DEVICES INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
LCC
|
DIP
|
Package Description |
QCCJ, LDCC68,1.0SQ
|
TOP BRAZED, DIP-64
|
Pin Count |
68
|
64
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED AT 5MHZ
|
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 40MHZ
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQCC-J68
|
R-CDIP-T64
|
JESD-609 Code |
e0
|
e0
|
Length |
24.2316 mm
|
81.407 mm
|
Low Power Mode |
NO
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
68
|
64
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Data Bus Width |
32
|
32
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC68,1.0SQ
|
DIP64,.9
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
4.572 mm
|
Supply Current-Max |
25 mA
|
80 mA
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
24.2316 mm
|
22.86 mm
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER
|
DSP PERIPHERAL, MULTIPLIER
|
Base Number Matches |
2
|
2
|
|
|
|
Compare LMU217JC25 with alternatives
Compare IDT7217L25C with alternatives