LMU217JC25 vs HMU17GM-60/883 feature comparison

LMU217JC25 LOGIC Devices Inc

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HMU17GM-60/883 Harris Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer LOGIC DEVICES INC HARRIS SEMICONDUCTOR
Part Package Code LCC
Package Description QCCJ, LDCC68,1.0SQ PGA, PGA68,11X11
Pin Count 68
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED AT 5MHZ 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 1MHZ
Boundary Scan NO NO
Clock Frequency-Max 40 MHz
External Data Bus Width 16 16
JESD-30 Code S-PQCC-J68 S-CPGA-P68
JESD-609 Code e0 e0
Length 24.2316 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3
Number of Terminals 68 68
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Data Bus Width 32 32
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ PGA
Package Equivalence Code LDCC68,1.0SQ PGA68,11X11
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER GRID ARRAY
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 25 mA 7 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form J BEND PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 24.2316 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER DSP PERIPHERAL, MULTIPLIER
Base Number Matches 2 1
Screening Level 38535Q/M;38534H;883B

Compare LMU217JC25 with alternatives

Compare HMU17GM-60/883 with alternatives