LMU217JC25
vs
AM29517A38DCB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
LCC
|
DIP
|
| Package Description |
QCCJ, LDCC68,1.0SQ
|
HDIP,
|
| Pin Count |
68
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED AT 5MHZ
|
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
40 MHz
|
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQCC-J68
|
R-CDIP-T64
|
| JESD-609 Code |
e0
|
|
| Length |
24.2316 mm
|
81.3435 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
68
|
64
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Data Bus Width |
32
|
32
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
HDIP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
6.858 mm
|
| Supply Current-Max |
25 mA
|
800 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
24.2316 mm
|
22.86 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER
|
DSP PERIPHERAL, MULTIPLIER
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare LMU217JC25 with alternatives
Compare AM29517A38DCB with alternatives