LMP8645HVMK
vs
LMP8645HVMKE
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
VSSOP, TSOP6,.11,37
|
VSSOP,
|
Pin Count |
6
|
6
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
20 µA
|
20 µA
|
Common-mode Reject Ratio-Nom |
95 dB
|
95 dB
|
Input Offset Voltage-Max |
1700 µV
|
1700 µV
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e4
|
e4
|
Length |
2.97 mm
|
2.97 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
VSSOP
|
Package Equivalence Code |
TSOP6,.11,37
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Slew Rate-Nom |
0.5 V/us
|
0.5 V/us
|
Supply Voltage Limit-Max |
13.2 V
|
13.2 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
1.65 mm
|
1.65 mm
|
Base Number Matches |
5
|
2
|
Samacsys Manufacturer |
|
Texas Instruments
|
|
|
|
Compare LMP8645HVMK with alternatives
Compare LMP8645HVMKE with alternatives