LMK04806BISQE/NOPB
vs
LMK04806BISQE
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| JESD-30 Code |
S-PQCC-N64
|
S-XQCC-N64
|
| JESD-609 Code |
e3
|
|
| Max I(ol) |
0.0005 A
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
QCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QFN
|
| Package Description |
|
HVQCCN,
|
| Pin Count |
|
64
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
9 mm
|
| Output Clock Frequency-Max |
|
2600 MHz
|
| Primary Clock/Crystal Frequency-Nom |
|
20.5 MHz
|
| Seated Height-Max |
|
0.8 mm
|
| Supply Voltage-Max |
|
3.45 V
|
| Supply Voltage-Min |
|
3.15 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Width |
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
|
CLOCK GENERATOR, OTHER
|
|
|
|
Compare LMK04806BISQE with alternatives