LMH6624MAX
vs
LMH6624MAX/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOIC-8
SOIC-8
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
20 µA
20 µA
Bias Current-Max (IIB) @25C
20 µA
20 µA
Common-mode Reject Ratio-Nom
90 dB
90 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
750 µV
750 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e3
Length
4.902 mm
4.902 mm
Low-Offset
YES
YES
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
-6.6 V
-6.6 V
Neg Supply Voltage-Nom (Vsup)
-2.5 V
-2.5 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TAPE AND REEL
TAPE AND REEL
Peak Reflow Temperature (Cel)
235
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.753 mm
1.753 mm
Slew Rate-Nom
300 V/us
300 V/us
Supply Current-Max
18 mA
18 mA
Supply Voltage Limit-Max
6.6 V
6.6 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Voltage Gain-Min
3160
3160
Wideband
YES
YES
Width
3.899 mm
3.899 mm
Base Number Matches
2
2
Compare LMH6624MAX with alternatives
Compare LMH6624MAX/NOPB with alternatives