LMH6622MM/NOPB vs LPC661AIM feature comparison

LMH6622MM/NOPB National Semiconductor Corporation

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LPC661AIM Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code SOIC SOIC
Package Description MSOP-8 PLASTIC, SOP-8
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 10 µA 0.4 µA
Bias Current-Max (IIB) @25C 10 µA
Common-mode Reject Ratio-Nom 100 dB 83 dB
Frequency Compensation YES
Input Offset Voltage-Max 1500 µV 3300 µV
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e0
Length 3 mm 4.9 mm
Low-Bias NO
Low-Offset NO
Micropower NO
Moisture Sensitivity Level 1 NOT SPECIFIED
Neg Supply Voltage Limit-Max -6.6 V
Neg Supply Voltage-Nom (Vsup) -2.5 V
Number of Functions 2 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power NO
Programmable Power NO
Qualification Status Not Qualified
Seated Height-Max 1.09 mm 1.75 mm
Slew Rate-Nom 80 V/us 0.11 V/us
Supply Current-Max 13 mA
Supply Voltage Limit-Max 6.6 V 16 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology BIPOLAR CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Voltage Gain-Min 3160
Wideband YES
Width 3 mm 3.9 mm
Base Number Matches 1 2
Pbfree Code No
kg CO2e/kg 12.3
Average Weight (mg) 53.65
CO2e (mg) 659.895
Category CO2 Kg 12.3
Unity Gain BW-Nom 350

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