LMH6609MFX vs CLC5802IM feature comparison

LMH6609MFX Texas Instruments

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CLC5802IM National Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code SOT-23 SOIC
Package Description TSSOP, TSOP5/6,.11,37 SOP, SOP8,.25
Pin Count 5 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 6 µA 65 µA
Bias Current-Max (IIB) @25C 5 µA 25 µA
Common-mode Reject Ratio-Nom 75 dB 60 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 3500 µV 3500 µV
JESD-30 Code R-PDSO-G5 R-PDSO-G8
JESD-609 Code e0 e0
Length 2.92 mm 4.9 mm
Low-Bias NO NO
Low-Offset NO NO
Micropower NO NO
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -6.6 V -7 V
Neg Supply Voltage-Nom (Vsup) -3.3 V -5 V
Number of Functions 1 2
Number of Terminals 5 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSOP5/6,.11,37 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TAPE AND REEL RAIL
Peak Reflow Temperature (Cel) 260
Power NO NO
Programmable Power NO NO
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.19 mm 1.75 mm
Slew Rate-Min 1200 V/us 275 V/us
Slew Rate-Nom 800 V/us 450 V/us
Supply Current-Max 8.5 mA 30 mA
Supply Voltage Limit-Max 6.6 V 7 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 180000 120000
Wideband YES YES
Width 1.6 mm 3.9 mm
Base Number Matches 2 3
Voltage Gain-Min 320

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