LMH6560MA vs LMH6560MAX feature comparison

LMH6560MA National Semiconductor Corporation

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LMH6560MAX Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 ,
Pin Count 14 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 14 µA 14 µA
Bandwidth (3dB)-Nom 280 MHz 280 MHz
Bias Current-Max (IIB) @25C 14 µA 10 µA
Input Offset Voltage-Max 25000 µV 25000 µV
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Length 8.6235 mm 8.6235 mm
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -6.5 V -6.5 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 1 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Current-Min 0.05 A 0.04 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Seated Height-Max 1.753 mm 1.753 mm
Slew Rate-Nom 3100 V/us 3100 V/us
Supply Current-Max 63 mA 63 mA
Supply Voltage Limit-Max 6.5 V 6.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.899 mm 3.899 mm
Base Number Matches 2 2
Packing Method TR

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