LMH6560MA
vs
LMH6560MAX
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP14,.25
,
Pin Count
14
14
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
BUFFER
BUFFER
Average Bias Current-Max (IIB)
14 µA
14 µA
Bandwidth (3dB)-Nom
280 MHz
280 MHz
Bias Current-Max (IIB) @25C
14 µA
10 µA
Input Offset Voltage-Max
25000 µV
25000 µV
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
Length
8.6235 mm
8.6235 mm
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-6.5 V
-6.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current-Min
0.05 A
0.04 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Seated Height-Max
1.753 mm
1.753 mm
Slew Rate-Nom
3100 V/us
3100 V/us
Supply Current-Max
63 mA
63 mA
Supply Voltage Limit-Max
6.5 V
6.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.899 mm
3.899 mm
Base Number Matches
2
2
Packing Method
TR
Compare LMH6560MA with alternatives
Compare LMH6560MAX with alternatives