LMH6523SQ/NOPB
vs
LT5527EUF#PBF
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
|
| Package Description |
WQFN-54
|
4 X 4 MM, PLASTIC, MO-220WGGC, QFN-16
|
| Pin Count |
54
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Analog Devices
|
| Gain Tolerance-Max |
25.74 dB
|
|
| JESD-30 Code |
R-XQCC-N54
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10 mm
|
4 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Channels |
4
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
54
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max |
485 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5.5 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
05-08-1692
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare LMH6523SQ/NOPB with alternatives
Compare LT5527EUF#PBF with alternatives