LMH6503MTX/NOPB
vs
CLC522AMC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
COMLINEAR CORP
Package Description
TSSOP,
DIE, DIE OR CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Analog IC - Other Type
ANALOG CIRCUIT
ANALOG CIRCUIT
JESD-30 Code
R-PDSO-G14
X-XUUC-N14
JESD-609 Code
e3
Length
5 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Max (Vsup)
-6 V
Neg Supply Voltage-Min (Vsup)
-2.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
40
Width
4.4 mm
Base Number Matches
2
2
Package Equivalence Code
DIE OR CHIP
Supply Current-Max (Isup)
63 mA
Technology
BIPOLAR
Compare LMH6503MTX/NOPB with alternatives
Compare CLC522AMC with alternatives