LMC7211BIMX
vs
MCP6561R-E/OT
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOIC-8
|
LSSOP, TSOP6,.11,37
|
Pin Count |
8
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.001 µA
|
0.005 µA
|
Input Offset Voltage-Max |
18000 µV
|
10000 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G5
|
JESD-609 Code |
e0
|
|
Length |
4.9 mm
|
2.9 mm
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage Limit-Max |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
5
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
PUSH-PULL
|
PUSH-PULL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LSSOP
|
Package Equivalence Code |
SOP8,.25
|
SOP6,.11,38
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
235
|
|
Qualification Status |
Not Qualified
|
|
Response Time-Nom |
4000 ns
|
56 ns
|
Seated Height-Max |
1.75 mm
|
1.45 mm
|
Supply Current-Max |
0.018 mA
|
0.13 mA
|
Supply Voltage Limit-Max |
16 V
|
6.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
1.6 mm
|
Base Number Matches |
2
|
1
|
Bias Current-Max (IIB) @25C |
|
0.005 µA
|
|
|
|
Compare LMC7211BIMX with alternatives
Compare MCP6561R-E/OT with alternatives