LMC6772BIN
vs
LM193MD8
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
WAFER
|
| Package Description |
DIP, DIP8,.3
|
DIE,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Input Offset Voltage-Max |
18000 µV
|
9000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Length |
9.817 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
4000 ns
|
1300 ns
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.025 mA
|
|
| Supply Voltage Limit-Max |
16 V
|
36 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
2
|
| Average Bias Current-Max (IIB) |
|
0.3 µA
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
MIL-STD-883
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LMC6772BIN with alternatives
Compare LM193MD8 with alternatives