LMC6772BIMX
vs
LM119F
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP, SOP8,.25
|
DFP, FL10,.3
|
| Pin Count |
8
|
10
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Input Offset Voltage-Max |
18000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-CDFP-F10
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
10
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-COLLECTOR/OPEN-EMITTER
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP8,.25
|
FL10,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
4000 ns
|
80 ns
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Current-Max |
0.025 mA
|
11.5 mA
|
| Supply Voltage Limit-Max |
16 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
3
|
4
|
| Average Bias Current-Max (IIB) |
|
1 µA
|
| Screening Level |
|
MIL-STD-883 Class C
|
|
|
|
Compare LMC6772BIMX with alternatives