LMC6482AMJ/883Q vs LMC6482AIMX/NOPB feature comparison

LMC6482AMJ/883Q Texas Instruments

Buy Now Datasheet

LMC6482AIMX/NOPB National Semiconductor Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, SOIC-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom 82 dB 82 dB
JESD-30 Code R-GDIP-T8 R-PDSO-G8
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.000004 µA
Common-mode Reject Ratio-Min 67 dB
Frequency Compensation YES
Input Offset Voltage-Max 750 µV
JESD-609 Code e3
Length 4.9 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Package Equivalence Code SOP8,.25
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Slew Rate-Min 0.7 V/us
Slew Rate-Nom 1.3 V/us
Supply Current-Max 1.9 mA
Supply Voltage Limit-Max 16 V
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1500
Voltage Gain-Min 13000

Compare LMC6482AMJ/883Q with alternatives

Compare LMC6482AIMX/NOPB with alternatives