LMC6462BIN vs LMC6462AIN feature comparison

LMC6462BIN National Semiconductor Corporation

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LMC6462AIN National Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP-8 DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.00001 µA 0.00001 µA
Common-mode Reject Ratio-Min 62 dB 67 dB
Common-mode Reject Ratio-Nom 74 dB 74 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 3000 µV 2000 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.817 mm 9.817 mm
Low-Bias YES YES
Low-Offset NO NO
Micropower YES YES
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL RAIL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Min 0.008 V/us 0.008 V/us
Slew Rate-Nom 0.023 V/us 0.023 V/us
Supply Current-Max 0.07 mA 0.07 mA
Supply Voltage Limit-Max 16 V 16 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Unity Gain BW-Nom 50 50
Width 7.62 mm 7.62 mm
Base Number Matches 2 2

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