LMC6442AIMM
vs
LMC6062AIM/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
TSSOP, TSSOP8,.19
ROHS COMPLIANT, SOIC-8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.000004 µA
0.000004 µA
Common-mode Reject Ratio-Nom
92 dB
85 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
4000 µV
900 µV
JESD-30 Code
S-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e3
Length
3 mm
4.9 mm
Low-Bias
YES
YES
Low-Offset
NO
YES
Micropower
YES
YES
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP8,.19
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Slew Rate-Min
0.0022 V/us
0.01 V/us
Slew Rate-Nom
0.0022 V/us
35000 V/us
Supply Current-Max
3.2 mA
0.055 mA
Supply Voltage Limit-Max
16 V
16 V
Supply Voltage-Nom (Vsup)
2.2 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
9.5
100
Voltage Gain-Min
4000
50000
Width
3 mm
3.9 mm
Base Number Matches
2
2
Part Package Code
SOIC
Pin Count
8
Common-mode Reject Ratio-Min
72 dB
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare LMC6442AIMM with alternatives
Compare LMC6062AIM/NOPB with alternatives