LMC6084AIM
vs
LM6161J-QMLV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
PLASTIC, SOP-14
CERAMIC, DIP-8
Pin Count
14
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.000004 µA
6 µA
Bias Current-Max (IIB) @25C
0.000004 µA
3 µA
Common-mode Reject Ratio-Nom
85 dB
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
350000 µV
10000 µV
JESD-30 Code
R-PDSO-G14
R-GDIP-T8
JESD-609 Code
e0
e0
Length
8.65 mm
Low-Bias
YES
Low-Offset
YES
NO
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
4
1
Number of Terminals
14
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Slew Rate-Min
0.6 V/us
180 V/us
Slew Rate-Nom
1.5 V/us
300 V/us
Supply Current-Max
4 mA
6.8 mA
Supply Voltage Limit-Max
16 V
18 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Unity Gain BW-Nom
1300
50000
Voltage Gain-Min
50000
300
Width
3.9 mm
7.62 mm
Base Number Matches
4
1
Packing Method
RAIL
Screening Level
MIL-STD-883
Compare LMC6084AIM with alternatives
Compare LM6161J-QMLV with alternatives