LMC6044IN
vs
LMC6044MDC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIE
Package Description
PLASTIC, DIP-14
DIE,
Pin Count
14
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.000004 µA
0.000004 µA
Common-mode Reject Ratio-Min
62 dB
62 dB
Common-mode Reject Ratio-Nom
75 dB
75 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
6000 µV
3000 µV
JESD-30 Code
R-PDIP-T14
X-XUUC-N
JESD-609 Code
e0
Length
19.18 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
4
4
Number of Terminals
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Slew Rate-Min
0.01 V/us
0.007 V/us
Slew Rate-Nom
0.02 V/us
0.02 V/us
Supply Current-Max
107 mA
0.068 mA
Supply Voltage Limit-Max
16 V
16 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
100
100
Voltage Gain-Min
50000
40000
Width
7.62 mm
Base Number Matches
2
2
Bias Current-Max (IIB) @25C
0.000004 µA
Input Offset Current-Max (IIO)
0.000002 µA
Packing Method
TUBE
Power
NO
Programmable Power
NO
Wideband
NO
Compare LMC6044IN with alternatives
Compare LMC6044MDC with alternatives