LMC6032IN/NOPB
vs
LM741CH
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP-8
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0002 µA
Common-mode Reject Ratio-Min
63 dB
Common-mode Reject Ratio-Nom
83 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
9000 µV
7500 µV
JESD-30 Code
R-PDIP-T8
O-MBCY-W8
JESD-609 Code
e3
e0
Length
9.8171 mm
Low-Bias
YES
Low-Offset
NO
NO
Micropower
YES
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
2
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
METAL
Package Code
DIP
Package Equivalence Code
DIP8,.3
CAN8,.2
Package Shape
RECTANGULAR
ROUND
Package Style
IN-LINE
CYLINDRICAL
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Slew Rate-Min
0.8 V/us
Slew Rate-Nom
1.1 V/us
Supply Current-Max
1.9 mA
Supply Voltage Limit-Max
16 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
NO
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
WIRE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
1400
Voltage Gain-Min
50000
Width
7.62 mm
Base Number Matches
2
9
Compare LMC6032IN/NOPB with alternatives
Compare LM741CH with alternatives