LMC6001CMDC
vs
LMV321IDBVRQ1
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
WAFER
|
SOT-23
|
Package Description |
DIE, DIE OR CHIP
|
ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Bias Current-Max (IIB) @25C |
0.000001 µA
|
0.25 µA
|
Common-mode Reject Ratio-Nom |
83 dB
|
65 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
2000 µV
|
9000 µV
|
JESD-30 Code |
X-XUUC-N
|
R-PDSO-G5
|
Low-Bias |
YES
|
NO
|
Low-Offset |
NO
|
NO
|
Micropower |
YES
|
YES
|
Neg Supply Voltage Limit-Max |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Number of Functions |
1
|
1
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
LSSOP
|
Package Equivalence Code |
DIE OR CHIP
|
TSOP5/6,.11,37
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Power |
NO
|
NO
|
Programmable Power |
NO
|
NO
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Slew Rate-Min |
0.6 V/us
|
|
Slew Rate-Nom |
1.5 V/us
|
1 V/us
|
Supply Current-Max |
0.95 mA
|
0.35 mA
|
Supply Voltage Limit-Max |
16 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Unity Gain BW-Nom |
1300
|
1000
|
Voltage Gain-Min |
60000
|
10000
|
Wideband |
NO
|
NO
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Pin Count |
|
5
|
Samacsys Manufacturer |
|
Texas Instruments
|
Average Bias Current-Max (IIB) |
|
0.5 µA
|
JESD-609 Code |
|
e4
|
Length |
|
2.9 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Terminals |
|
5
|
Packing Method |
|
TAPE AND REEL
|
Peak Reflow Temperature (Cel) |
|
260
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
1.45 mm
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Pitch |
|
0.95 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
1.6 mm
|
|
|
|
Compare LMC6001CMDC with alternatives
Compare LMV321IDBVRQ1 with alternatives