LMC6001CIN
vs
MCP601-E/P
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PLASTIC, DIP-8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.000001 µA
|
0.005 µA
|
| Bias Current-Max (IIB) @25C |
0.000001 µA
|
|
| Common-mode Reject Ratio-Min |
63 dB
|
75 dB
|
| Common-mode Reject Ratio-Nom |
83 dB
|
90 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
1350 µV
|
4500 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
9.817 mm
|
9.46 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Neg Supply Voltage Limit-Max |
-8 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.32 mm
|
| Slew Rate-Min |
0.6 V/us
|
|
| Slew Rate-Nom |
1.5 V/us
|
2.3 V/us
|
| Supply Current-Max |
0.95 mA
|
0.325 mA
|
| Supply Voltage Limit-Max |
8 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1300
|
2800
|
| Voltage Gain-Min |
60000
|
56200
|
| Wideband |
NO
|
NO
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Packing Method |
|
TUBE
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare LMC6001CIN with alternatives
Compare MCP601-E/P with alternatives