LMC555ENG
vs
MC1455BP1G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Package Description
DIP,
PLASTIC, DIP-8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
9.817 mm
9.78 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Frequency-Max
3 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
12 V
16 V
Supply Voltage-Min (Vsup)
1.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
DIP
Pin Count
8
JESD-609 Code
e3
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
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