LMC555CN vs NE555JG feature comparison

LMC555CN National Semiconductor Corporation

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NE555JG Texas Instruments

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Package Description DIP-8 DIP, DIP8,.3
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE
JESD-30 Code R-PDIP-T8 R-GDIP-T8
JESD-609 Code e0
Length 9.817 mm 9.6 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Frequency-Max 3 MHz
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 12 V 16 V
Supply Voltage-Min (Vsup) 1.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Part Package Code DIP
Pin Count 8
Samacsys Manufacturer Texas Instruments
Additional Feature IT CAN ALSO OPERATE AT 15V NOM

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Compare NE555JG with alternatives