LMA2010KME65
vs
IDT7210L65P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
DIP
Package Description
QCCN, LCC68,.95SQ
0.900 INCH, PLASTIC, DIP-64
Pin Count
68
64
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
Boundary Scan
NO
NO
Clock Frequency-Max
15.38 MHz
External Data Bus Width
16
16
JESD-30 Code
S-CQCC-N68
R-PDIP-T64
JESD-609 Code
e0
e0
Length
24.1935 mm
81.534 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
3
Number of Terminals
68
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
35
35
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
DIP
Package Equivalence Code
LCC68,.95SQ
DIP64,.9
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
Seated Height-Max
3.048 mm
5.842 mm
Supply Current-Max
25 mA
122.31 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
24.1935 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
1
1
Time@Peak Reflow Temperature-Max (s)
30
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