LMA1010GC25
vs
IDT7210L25JB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PGA
|
LCC
|
| Package Description |
PGA, PGA68,11X11
|
QCCJ,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
40 MHz
|
10 MHz
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-CPGA-P68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29.4386 mm
|
24.2062 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Data Bus Width |
35
|
35
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
QCCJ
|
| Package Equivalence Code |
PGA68,11X11
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.81 mm
|
4.572 mm
|
| Supply Current-Max |
25 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Width |
29.4386 mm
|
24.2062 mm
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 CLASS B
|
|
|
|
Compare LMA1010GC25 with alternatives
Compare IDT7210L25JB with alternatives