LM86CIMX
vs
ADM1032ARM-REEL7
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ON SEMICONDUCTOR
|
Package Description |
0.150 INCH, PLASTIC, MS-012, SOIC-8
|
MO-187AA, MSOP-8
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Accuracy-Max (Cel) |
3 Cel
|
|
Body Breadth |
3.9 mm
|
|
Body Height |
1.72 mm
|
|
Body Length or Diameter |
4.89 mm
|
|
Housing |
PLASTIC
|
|
JESD-609 Code |
e0
|
e0
|
Mounting Feature |
SURFACE MOUNT
|
|
Number of Bits |
11
|
|
Number of Terminals |
8
|
8
|
Operating Current-Max |
0.8 mA
|
|
Operating Temperature-Max |
125 °C
|
120 °C
|
Operating Temperature-Min |
|
|
Output Interface Type |
2-WIRE INTERFACE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape/Style |
RECTANGULAR
|
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Coefficient |
NEGATIVE/POSITIVE ppm/°C
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Termination Type |
SOLDER
|
|
Base Number Matches |
2
|
3
|
Pbfree Code |
|
No
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
8
|
Analog IC - Other Type |
|
ANALOG CIRCUIT
|
JESD-30 Code |
|
S-PDSO-G8
|
Length |
|
3 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
1
|
Package Code |
|
TSSOP
|
Package Shape |
|
SQUARE
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Temperature Grade |
|
OTHER
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
3 mm
|
|
|
|
Compare LM86CIMX with alternatives
Compare ADM1032ARM-REEL7 with alternatives